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Heat Dissipation Module Product List and Ranking from 5 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 30, 2026～Oct 27, 2026
This ranking is based on the number of page views on our site.

Heat Dissipation Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 30, 2026～Oct 27, 2026
This ranking is based on the number of page views on our site.

  1. 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  2. 株式会社がまかつ Hyogo//Manufacturing and processing contract
  3. KOTRA名古屋 韓国貿易センター（名古屋） Aichi//Service Industry
  4. オリナス 東京営業所、名古屋営業所、京都営業所、大阪営業所、香港 Osaka//Trading company/Wholesale
  5. 5 福江産業 Chiba//Trading company/Wholesale
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Heat Dissipation Module Product ranking

Last Updated： Aggregation Period:Sep 30, 2026～Oct 27, 2026
This ranking is based on the number of page views on our site.

  1. Support for copper coin (thermal dissipation structure) wiring board. 沖電気工業 産業営業本部　産業営業統括室
  2. Hybrid of metal and carbon for electronic devices. 株式会社がまかつ
  3. [DONGYANG PISTON] Enclosure and others KOTRA名古屋 韓国貿易センター（名古屋）
  4. Heat dissipation components オリナス 東京営業所、名古屋営業所、京都営業所、大阪営業所、香港
  5. 4 High thermal conductivity substrate "copper coin" 福江産業

Heat Dissipation Module Product List

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Support for copper coin (thermal dissipation structure) wiring board.

Support for copper coin (thermal dissipation structure) wiring board.

We will introduce methods for heat dissipation in printed circuit boards.

As components and enclosures become smaller, the surface area of components decreases, and the lack of area to dissipate heat from ICs needs to be compensated by the substrate. At Oki Electric Industry, we have realized a structure that locally dissipates heat by embedding cylindrical copper into printed circuit boards, maximizing the thermal conductivity of copper (approximately 390W/m·K). 【Features】 ■ Embedding copper coins in heat-generating areas to efficiently utilize copper's thermal conductivity (390W/m·K) for heat dissipation. *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Heat Dissipation Module

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Heat dissipation components

Heat dissipation components

We can provide a wide range of proposals tailored to your needs.

【Product Lineup】 Heat Sink Heat Pipe Thermal Conductive Sheet Peltier Element

  • PLC
  • Other electronic parts
  • Signal Generator
  • Heat Dissipation Module

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High thermal conductivity substrate "copper coin"

High thermal conductivity substrate "copper coin"

Improved heat dissipation by embedding copper coins in the circuit board.

Copper coins are components with excellent thermal conductivity. By embedding copper coins into circuit boards, it has become possible to efficiently dissipate heat generated by electronic components on the circuit board to the outside. This is an extremely effective thermal management solution for 5G communication devices, medical equipment, automotive parts, and more. We can process shapes that meet specific needs, with a machining precision of ±0.01mm. Through strict quality control, we guarantee stable and high product quality.

  • Printed Circuit Board
  • Heat Dissipation Module

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[DONGYANG PISTON] Enclosure and others

[DONGYANG PISTON] Enclosure and others

Inclosure/Manifold (FCV) and others

Enclosure/Manifold - Joining of dissimilar materials (aluminum, plastic) Heat dissipation module - Design capability for maximizing cooling efficiency

  • Engine parts
  • Other Auto Parts
  • Heat Dissipation Module

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Hybrid of metal and carbon for electronic devices.

Hybrid of metal and carbon for electronic devices.

Enhancing the heat dissipation of electronic devices through the fusion of metal and carbon.

In the field of electronic devices, the efficient dissipation of heat generated by increased performance is considered crucial for the stable operation and longevity of products. This is particularly challenging in compact devices, where heat dissipation design must be addressed within limited space. Insufficient heat dissipation can lead to performance degradation or failure due to overheating of components. Our hybrid materials, combining metal's thermal conductivity with carbon's lightweight and high rigidity, contribute to improved heat dissipation. 【Application Scenarios】 - Heat dissipation components for electronic device enclosures - Cooling mechanism components such as CPU coolers - Heat dissipation materials for high-power devices 【Benefits of Implementation】 - Suppression of temperature rise inside devices - Improved reliability of components - Contribution to miniaturization and lightweight design of products

  • IMG_4624.JPG
  • IMG_4625.JPG
  • Other machine elements
  • Heat Dissipation Module

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